Stochastic thermal deformation and thermal stress in a laminated plate including FGM layer under random surface temperatures

Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 68, Issue 11, 2002, Pages 1588-1593

  Sugano, Yoshihiro ^a   Kanno, Toshihiro ^b   Chiba, Ryoichi ^b  

^a IWATE UNIVERSITY   (Japan)

^b NONE

Author keywords

Analytical Solution; Functionally Graded Material; Laminated Plate; Random Surface Temperature; Stochastic Thermal Deformation; Stochastic Thermal Stress; Thermoelasticity

Indexed keywords

DEFORMATION; LAMINATES; PLATES (STRUCTURAL COMPONENTS); SPECIFIC HEAT; THERMAL CONDUCTIVITY; THERMAL STRESS; THERMOELASTICITY;

THERMAL DEFORMATION;

FUNCTIONALLY GRADED MATERIALS;

EID: 0036874478     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.68.1588     Document Type: Article

References (10)

1. Clifton. S., Int. Trans. ASME, 9(1966), 301.
2. Sugano, Y., Ing.-Arch., 57-2(1987), 147.
3. Suresh,S. & Mortensen, A., Fundamentals of Functionally Graded Materials, (1998), 100, IOM Communi. Ltd.