Studies of a reactive sputter ion plating for preparation of TiN films using a facing target sputter and immersed inductive coupled plasma source

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 11, 2002, Pages 6563-6569

  Sung, Youl Moon ^a   Otsubo, Masahisa ^a   Honda, Chikahisa ^a   Park, Chung Hoo ^b  

^a UNIVERSITY OF MIYAZAKI   (Japan)

^b Pusan National University   (South Korea)

Author keywords

Facing target sputtering; Inductive coupled plasma; Ion energy distributio; Sputter ion plating; TiN thin film

Indexed keywords

ELECTRONIC PROPERTIES; FILM PREPARATION; INDUCTIVELY COUPLED PLASMA; ION BOMBARDMENT; PLASMA DENSITY; PLASMA SOURCES; THIN FILMS; TITANIUM NITRIDE; TITANIUM PLATING;

ION PLATING;

METALLIC FILMS;

EID: 0036872548     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.6563     Document Type: Article

References (17)

1. S. M. Rossnagel, J. J. Cuomo and W. D. Westwood: Handbook of Plasma Processing Technology (Noyes, Park Ridge. NJ. 1990).
2. N. A. G. Ahmed: Ion Plating Technology-Developments and Applications (John Willy & Sons, Chichester, 1987).
3. J. Hopwood: Plasma Source Sci. Technol. 1 (1992) 109.
4. Y. M. Sung, K. Uchino, K. Muraoka and T. Sakoda: J. Vac. Sci. Technol. A 18 (2000) 2149.
5. Y. Okraku-Yirenkyi, Y. M. Sung, M. Otsubo, C. Honda and T. Sakoda: J. Vac. Sci. Technol. A 19 (2001) 2590.
6. T. C. Christensen and Z. G. T. Guiragossian: IEEE Trans. Nucl. Sci. 28 (1981) 2666.
7. M. C. Vella, K. W. Ehlers, K. Kippenhan, P. A. Pincosy and R. V. Pyle: J. Vac. Sci. Technol. A 3 (1985) 1218.
8. M. Naoe, S. Yamanaka and Y. Hoshi: IEEE Trans. Magn. 16 (1980) 646.
9. S. C. Yu, J. S. Back, S. Nakagawa and M. Naoe: J. Magn. and Magn. Mater. 155 (1996) 77.
10. D. A. Glocker and S. I. Shah: Handbook of Thin Film Process Technology (IOP Publishing, Bristol, 1995).
11. T. Uchida: Elementary Plasma Engineerning (Tokyo, 1986).
12. O. Auciello and D. L. Hamm: Plasma Diognostics (Academic Press, 1989) Vol. 1, Discharge parameters and chemistry.
13. J. L. Vossen and W. Kern: Thin Films Process, (Academic Press, 1978).
14. G. Y. Yeom and J. A. Thornton: J. Appl. Phys. 65 (1989) 3816.
15. J. W. Coburn and E. Kay: J. Appl. Phys. 43 (1972) 4965.
16. D. Heim and H. Stori: J. Appl. Phys. 72 (1992) 3330.
17. D. R. Mckenzie, W. D. Mcfall and H. H. Han: Surf. Coating Technol. 81 (1996) 954.