The formation of copper electrodeposits with highly preferred orientation and their surface morphology

Acta Physico - Chimica Sinica

Volumn 18, Issue 11, 2002, Pages 973-978

  Min, Gu ^a,b   Yang, Fang Zu ^b   Ling, Huang ^b   Yao, Shi Bing ^b   Zhou, Shao Min ^b  

^a SHANTOU UNIVERSITY   (China)

^b XIAMEN UNIVERSITY   (China)

Author keywords

Copper electrodeposit; Electrodeposition; Highly preferred orientation; Surface morphology

Indexed keywords

COPPER; COPPER SULFATE; SULFURIC ACID;

ARTICLE; CRYSTALLIZATION; ELECTROLYSIS; MORPHOLOGY; ORIENTATION;

EID: 0036870389     PISSN: 10006818     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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