Effective and environmentally friendly remover for photo resist and ashing residue for use in Cu/low-k process

IEEE Transactions on Semiconductor Manufacturing

Volumn 15, Issue 4, 2002, Pages 429-433

  Koito, Tatsuya ^a   Hirano, Keiji ^a   Nakabeppu, Ken Ichi ^b  

^a NEC CORPORATION   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

Benzotriazole (BTA, C6H5N3); Biodegradation; Copper wire low dielectric interlayer (Cu low k) remover; Corrosion inhibitor; Mutagenicity; Uric acid (C5H4N4O3)

Indexed keywords

BIODEGRADATION; COPPER CORROSION; CORROSION INHIBITORS; DIELECTRIC MATERIALS; ENVIRONMENTAL IMPACT; OPTIMIZATION; WASTEWATER;

ASHING RESIDUES;

PHOTORESISTS;

EID: 0036869344     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2002.804910     Document Type: Conference Paper

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