Lead-free ball-grid array balls: Production method and properties

Journal of Electronic Materials

Volumn 31, Issue 11, 2002, Pages 1270-1275

  Kempf, B ^a   Graff, M ^a   Hutin, O ^a   Rettenmayr, M ^b  

^a OMG AG and Co KG   (Germany)

^b DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Lead free GBA balls; Production method; Sn Pb eutectic

Indexed keywords

LEAD ALLOYS; LIQUIDS; METAL MELTING; OXIDATION; PARTICLE SIZE ANALYSIS; SOLDERING ALLOYS; SOLIDIFICATION; SURFACE TENSION; TIN ALLOYS;

BALL GRID ARRAYS; BALL-FORMING METHOD; LEAD-FREE BALLS; LIQUID ALLOYS; PRODUCTION METHOD; TIN-BASED SOFT SOLDER;

ELECTRONICS PACKAGING;

EID: 0036865805     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0020-z     Document Type: Article

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