Magnetic properties of electrochemically deposited Ni/Cu superlattices

Journal of the Electrochemical Society

Volumn 149, Issue 11, 2002, Pages

  Tokarz, Adam ^a   Wolkenberg, Andrzej ^a,b   Przeslawski, Tomasz ^b  

^a CZESTOCHOWA UNIVERSITY OF TECHNOLOGY   (Poland)

^b Department of Micro and Nanotechnology of Wide Bandgap Semiconductors   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; EVAPORATION; MAGNETIC PROPERTIES; MAGNETORESISTANCE; MULTILAYERS; NICKEL; PH EFFECTS; SECONDARY ION MASS SPECTROMETRY; SILICON WAFERS; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

LAYER THICKNESS; STRUCTURAL PROPERTIES; SULFAMATE SOLUTION;

SUPERLATTICES;

EID: 0036863637     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1512914     Document Type: Article

References (7)

1. L. H. Bennet, D. S. Lashmore, M. P. Dariel, M. J. Kaufman, M. Rubinstein, P. Lubitz, O. Zadok, and J. Yahalom, J. Magn. Magn. Mater., 67, 239 (1987).
2. T. Szczurek, T. Rausch, M. Schlesinger, D. D. Snyder, and C. H. Olk, J. Electrochem. Soc., 146, 1777 (1995).
3. K. D. Bird and M. Schlesinger, J. Electrochem. Soc., 142, L65 (1995).
4. M. A. Ruderman and C. Kittel. Phys. Rev., 96, 99 (1951).
5. T. Kasuya, Prog. Theor. Phys. 16, 45 (1956).
6. K. Yosida, Phys. Rev., 106, 893 (1957).
7. J. W. Smits, Phys. World, 11, 48 (1992).