Cleaning of wafer edge, bevel and back-side with a torus-shaped capacitively coupled plasma

Plasma Sources Science and Technology

Volumn 11, Issue 4, 2002, Pages 520-524

  Jeon, Buil ^a   Chang, Hong Young ^a   Song, Jong Kyu ^b   Jeon, Chang Won ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Sosul Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; PLASMA SOURCES; POLYSILICON; SILICA;

WAFER EDGES;

MICROPROCESSOR CHIPS;

EID: 0036861680     PISSN: 09630252     EISSN: None     Source Type: Journal    
DOI: 10.1088/0963-0252/11/4/319     Document Type: Article

References (4)

1. Itoh M., Ishii Y., Jinbo T., Akimori H., Futase T. and Saeki T. 2000 IEEE Trans. Semiconductor Manufacturing 13 300.
2. Lieberman M.A. and Lichtenberg A.J. 1994 Principles of Plasma Discharges and Materials Processing (New York: Wiley).
3. Jaeger R.C. 1993 Introduction to Microelectronic Fabrication (Reading, MA: Addison-Wesley).
4. Surendra M. and Graves D.B. 1991 Appl. Phys. Lett. 59 2091.