Modelling interconnects with surface roughness

Microelectronics Journal

Volumn 33, Issue 11, 2002, Pages 929-934

  Patrikar, Rajendra M ^a   Dong, Chong Yi ^b   Zhuang, Wenjun ^a  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b STANFORD UNIVERSITY   (United States)

Author keywords

Design verification; Interconnect modelling; Parameter extraction; Surface roughness

Indexed keywords

COMPUTER SIMULATION; ELECTRIC FIELD EFFECTS; FABRICATION; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; SURFACE ROUGHNESS;

INTERCONNECTED SURFACES;

INTERCONNECTION NETWORKS;

EID: 0036858126     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(02)00105-2     Document Type: Conference Paper

References (12)

1. Caignet F., Delmas-Bendhia S., Sicard E. The challenges of signal integrity in deep submicrometer CMOS technology. Proc. IEEE. 89:(4):2001;556-573.
2. Goncalves F.M., Teixeira I.C., Teixeira J.P. Realistic fault extraction for high-quality design and test of VLSI systems. IEEE Int. Symp. Defect Fault Tolerance VLSI Syst. 1997;29-37.
3. Cao W.H., Lo C.Y., Basel M., Singh R. Parasitic extraction: current state of art and future trend. Proc. IEEE. 89:(5):2001;729-739.
4. Bryant R.E., Cheng K.T., Kahng A.B., Keutzer K., maly W., Newton R., Pieleggi L., Rabaey J.M., Sangiovanni-Vincentelli A. Limitations and challenges of computer-aided design technology for CMOS VLSI. Proc. IEEE. 89:(3):2001;341-365.
5. Jin W., Eo Y., Eisentadt W.R., Shim J. Fast and accurate quasi-three-dimensional capacitance determination of multilayer VLSI interconnects. Trans. VLSI Syst. 9:(3):2001;450-460.
6. Dengi E.A. Boundary element method macromodels for 2-D hierarchical capacitance extraction. Proc. 35th DAC. 1998;218.
7. Wang Y., Overhauser D., Basel M. Accurate parasitic resistance extraction for interconnection analysis. Custom Integ. Circuits Conf. 1995;255.
8. Cho W., Ahn Y., Baek C.-W., Kim Y.-K. Effect of mechanical process parameters on chemical mechanical polishing of Al thin films. Microelectron. Engng. 2002;. in press.
9. Lai L., Irene E.A. Area evaluation of microscopically rough surface. J. Vac. Sci. Technol. B. 17:1999;33-39.
10. Wu J.-J. Characterization of fractal surface. Wear. 239:2000;36-47.
11. Liu H.D., Zhao Y.P., Ramanath G., Murarka S.P., Wang G.C. Thickness dependant electrical resistivity of ultrathin (<40 nm) Cu films. Thin Solid Films. 384:2001;151-156.
12. Namba Y. Resistivity and temperature coefficient of thin metal films with rough surface. Jpn. J. Appl. Phys. 9:1970;1326-1329.