Electrode sticking during micro-resistance welding of thin metal sheets

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 4, 2002, Pages 355-361

  Dong, S J ^a   Kelkar, G P ^b   Zhou, Y ^c  

^a HUBEI UNIVERSITY OF AUTOMOTIVE TECHNOLOGY   (China)

^b Unitek Miyachi Corporation   (United States)

^c UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Cell phone battery application; Electrode sticking mechanism; Micro resistance welding; TiC composite coating; Very thin metal sheets

Indexed keywords

BOND STRENGTH (MATERIALS); CELLULAR TELEPHONE SYSTEMS; ELECTRODES; ENERGY DISPERSIVE SPECTROSCOPY; METALLIC MATRIX COMPOSITES; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SECONDARY BATTERIES; TELEPHONE SETS; TITANIUM CARBIDE; WELDING;

ELECTRODE STICKING MECHANISM; MICRO-RESISTANCE WELDING;

ELECTRONICS PACKAGING;

EID: 0036826446     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.807732     Document Type: Article

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