Dry I.B. forecasting of commercial tannin adhesives-bonded particleboard by TMA bending

Holz als Roh - und Werkstoff

Volumn 60, Issue 5, 2002, Pages 372-

  Garnier, S ^a   Pizzi, A ^a   Huang, Z ^b  

^a UNIVERSITÉ DE LORRAINE   (France)

^b RESEARCH INSTITUTE OF FORESTRY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BENDING STRENGTH; FORMALDEHYDE; MATERIALS TESTING; THERMOMECHANICAL TREATMENT;

DRY INTERNAL BOND; TANNIN FORMALDEHYDE RESINS;

WOOD;

ADHESIVES; BEND TESTS; BONDING STRENGTH; FORMALDEHYDE; TANNINS; Z DIRECTION STRENGTH;

EID: 0036803212     PISSN: 00183768     EISSN: None     Source Type: Trade Journal    
DOI: 10.1007/s00107-001-0253-1     Document Type: Article

References (3)

1. Pizzi A (1994) Advanced Wood Adhesives Technology, Dekker, New York, pp.141
2. Pizzi A (1997) On the correlation of some theoretical and experimental results in polycondensation resins networking, J Appl Polymer Sci 63: 603-614
3. Zhao C, Garnier S, Pizzi A (1998) Particleboard dry and wet IB forecasting by gel time and dry TMA bending in PF wood adhesives, Holz Roh- Werkstoff, 56: 6, 402