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Volumn 32, Issue 10, 2002, Pages 1645-1651

Development of new device for measuring thermal stresses

Author keywords

Coefficient of thermal expansion; Degree of constraint; Developed device; Modulus of elasticity; Thermal stress

Indexed keywords

CONCRETE CONSTRUCTION; ELASTIC MODULI; FORCE MEASUREMENT; TEMPERATURE DISTRIBUTION; THERMAL EXPANSION;

EID: 0036779216     PISSN: 00088846     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0008-8846(02)00842-6     Document Type: Article
Times cited : (27)

References (8)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.