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Volumn 32, Issue 10, 2002, Pages 1645-1651
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Development of new device for measuring thermal stresses
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Author keywords
Coefficient of thermal expansion; Degree of constraint; Developed device; Modulus of elasticity; Thermal stress
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Indexed keywords
CONCRETE CONSTRUCTION;
ELASTIC MODULI;
FORCE MEASUREMENT;
TEMPERATURE DISTRIBUTION;
THERMAL EXPANSION;
THERMAL FORCES;
THERMAL STRESS;
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EID: 0036779216
PISSN: 00088846
EISSN: None
Source Type: Journal
DOI: 10.1016/S0008-8846(02)00842-6 Document Type: Article |
Times cited : (27)
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References (8)
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