Investigation of Cu metallization for Si solar cells

Solar Energy Materials and Solar Cells

Volumn 74, Issue 1-4, 2002, Pages 91-96

  Kang, Jinmo ^a   You, JaeSung ^b   Kang, ChoonSik ^b   Pak, James Jungho ^a   Kim, Donghwan ^a  

^a Korea University   (South Korea)

^b Seoul National University   (South Korea)

Author keywords

Contact resistance; Cu metallization; Etch pits; High efficiency; Silicon; Solar cells

Indexed keywords

COPPER PLATING; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; ELECTROPLATING; METALLIZING; RAPID THERMAL ANNEALING; VACUUM;

CONTACT RESISTANCE; VACUUM ANNEALING;

SILICON SOLAR CELLS;

EID: 0036778403     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-0248(02)00052-1     Document Type: Article

References (6)

1. Experiments on anisotropic etching of Si in TMAH
2. Diffusion of metals in silicon dioxide
3. Copper Deposition and Thermal Stability Issues in Copper-based Metallization for ULSI Technology
4. Copper metallization for ULSI and beyond