Advanced Hi-Fill® for interconnect liner applications

Microelectronic Engineering

Volumn 64, Issue 1-4, 2002, Pages 99-105

  Urbansky, N ^a   Burgess, S R ^b   Schmidbauer, S ^a   Heydenreich, U ^b   Donohue, H ^b   Moncrieff, I ^b   Gorgens C ^c  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b Trikon Technologies Ltd   (United Kingdom)

^c Trikon Technologies GmbH   (Germany)

Author keywords

Deposition process; Diffusion barrier; Interconnect liner; Ti TiN

Indexed keywords

DEPOSITION; DIFFUSION; DYNAMIC RANDOM ACCESS STORAGE; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; METALLIZING; TITANIUM NITRIDE;

INTERCONNECT LINERS;

ELECTRIC CONNECTORS;

EID: 0036776634     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00787-6     Document Type: Conference Paper

References (2)

1. Enhancement of bottom coverage of sub-micron contact holes using a novel Hi-Fill® Ti/TiN sputter process