A 2-bit RF MEMS phase shifter in a thick-film BGA ceramic package

IEEE Microwave and Wireless Components Letters

Volumn 12, Issue 9, 2002, Pages 321-323

  Varian, K ^a   Walton, D ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

Ball grid arrays; Micromechanical devices; Packaging; Switching circuits

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; INSERTION LOSSES; PHASE SHIFTERS; SWITCHING CIRCUITS; THICK FILMS;

BALL GRID ARRAYS (BGA);

MICROELECTROMECHANICAL DEVICES;

EID: 0036743922     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2002.803201     Document Type: Article

References (5)

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2. B. Pillans, A. Malczewski, S. Eshelman, J. Ehmke, and C. L. Goldsmith, "Ka-band RF MEMS phase shifters," IEEE Microwave Guided Wave Lett., vol. 9, pp. 520-522, Dec. 1999.
3. C.L. Goldsmith, Z. Yao, S. Eshelman, and D. Denniston, "Performance of low-loss RF MEMS capacitive switches," IEEE Microwave Guided Wave Lett., vol. 8, pp. 269-271, Aug. 1998.
4. A. Margomenos, D. Peroulis, K. J. Herrick, and L. P. B. Katehi, "Silicon micromachined packages for RF MEMS switches," in Proc. 31st Eur. Microwave Conf., Sept. 2001, pp. 271-274.
5. A. Jourdain, S. Brebels, W. De Raedt, and H. A. C. Tilmans, "Influence of O-level packaging on the microwave performance of RF-MEMS devices," in Proc. 31st Eur. Microwave Conf., Sept. 2001, pp. 403-406.