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Journal of Micromechanics and Microengineering

Volumn 12, Issue 5, 2002, Pages 714-722

Fracture analysis of thick plasma-enhanced chemical vapor deposited oxide films for improving the structural integrity of power MEMS

(3) Chen, K S a Chen, J Y a Lin, S Y a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CRACK PROPAGATION; FAILURE ANALYSIS; FRACTURE MECHANICS; MATHEMATICAL MODELS; MICROSTRUCTURE; OPTIMIZATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RESIDUAL STRESSES; SILANES; THERMAL STRESS; THICK FILMS;

FRACTURE ANALYSIS; MICROSCOPE ANNIHILATION; OXIDE FILMS; POWER MICROELECTROMECHANICAL SYSTEMS; STRUCTURAL INTEGRITY;

MICROELECTROMECHANICAL DEVICES;

EID: 0036732314 PISSN: 09601317 EISSN: None Source Type: Journal
DOI: 10.1088/0960-1317/12/5/330 Document Type: Article

Times cited : (10)

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