Effect of Ti upon the interfacial reaction in SiCp/Al composites during multiple remelting above the liquidus

Journal of Materials Science Letters

Volumn 21, Issue 15, 2002, Pages 1157-1161

  Fan, Tongxiang ^a   Zhang, Di ^a   Wu, Renjie ^a   Shibayanagi, Toshiya ^b   Naka, Masaki ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0036728674     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1016547830345     Document Type: Article

References (22)