Mold-filling ability of semisolid alloy

Journal of University of Science and Technology Beijing: Mineral Metallurgy Materials (Eng Ed)

Volumn 9, Issue 4, 2002, Pages 253-257

  Xing, Shuming ^a   Zhang, Lizhong ^a   Zeng, Daben ^b   Shi, Juntao ^b  

^a BEIJING JIAOTONG UNIVERSITY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Aluminum alloy; Mold filling ability; Semisolid alloy; Semisolid processing

Indexed keywords

DENSITY (SPECIFIC GRAVITY); MATHEMATICAL MODELS; METAL PRESSING; METALLOGRAPHIC MICROSTRUCTURE; SOLIDIFICATION; SURFACE TENSION; THERMAL EFFECTS;

INVERTED EXTRUSION; KEEPING TEMPERATURE; MOLD FILLING ABILITY; SEMISOLID ALLOY;

METAL PRESSING;

EID: 0036706067     PISSN: 10058850     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

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