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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 7 A, 2002, Pages 4503-4508

Interfacial reaction of W/Cu examined by an n-body potential through molecular dynamics simulations

(5) Kong, Ling Ti a Li, Xin Yu a Lai, Wen Sheng a Liu, Jian Bo a Liu, Bai Xin a

a TSINGHUA UNIVERSITY (China)

Author keywords

Cu W; Diffusion barrier; EAM; Interfacial reaction; Molecular dynamics simulation

Indexed keywords

ATOMS; COMPUTER SIMULATION; COPPER; DIFFUSION; METALLIZING; MOLECULAR DYNAMICS; PHASE EQUILIBRIA; TUNGSTEN;

DISORDERED INTERLAYER; EMBEDDED ATOM METHOD; INTERFACIAL REACTIONS; METALLIZATION TECHNOLOGY;

INTERFACES (MATERIALS);

EID: 0036655518 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.41.4503 Document Type: Article

Times cited : (13)

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