Solutions for maximizing die yield at 0.13μm

Solid State Technology

Volumn 45, Issue 7, 2002, Pages 141-142+144+146

  Ferguson, John ^a   Moore, Andrew J ^a  

^a MENTOR GRAPHICS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DIES; ELECTRIC FIELD EFFECTS; INTEGRATED CIRCUIT LAYOUT; METALS; OPTIMIZATION; OXIDES; SEMICONDUCTOR DIODES;

ELECTRICAL CHARGE EFFECTS; METAL FILL; PLANARITY; TOTAL CHIP YIELD;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0036649887     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)