Characteristics of a direct ion beam deposition source

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 20, Issue 4, 2002, Pages 1314-1319

  Kim, Daeil ^a   Kim, Steven ^a  

^a SKION Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ATOMIC PHYSICS; CARBON; COPPER; DEPOSITION; ION BOMBARDMENT; NICKEL; PROCESS CONTROL; SILICON; TANTALUM; TUNGSTEN;

BOMBARDING ENERGY; DEPOSITION RATE; ION BEAM DEPOSITION SOURCE; SECONDARY ION ENERGY DISTRIBUTIONS;

ION BEAMS;

EID: 0036649067     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1482707     Document Type: Article

References (24)