Interface debonding model and its application to the mixed mode interface fracture toughness

International Journal of Damage Mechanics

Volumn 11, Issue 3, 2002, Pages 263-286

  Omiya, Masaki ^a   Kishimoto, Kikuo ^a   Yang, Wei ^b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Finite element method; Fracture mechanics; Interface crack; Interface debonding model; Interface fracture toughness; J integral; Mixed mode

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; DEBONDING; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; RIGIDITY; STRESS INTENSITY FACTORS; THERMODYNAMICS;

MIXED MODE INTERFACE FRACTURE TOUGHNESS; PHASE ANGLE; SOFTWARE PACKAGE ABAQUS;

INTERFACES (MATERIALS);

EID: 0036648245     PISSN: 10567895     EISSN: None     Source Type: Journal    
DOI: 10.1106/105678902026413     Document Type: Article

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