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Journal of Materials Science

Volumn 37, Issue 13, 2002, Pages 2669-2684

Strength and dynamic fatigue of silicon nitride at intermediate temperatures

(5) Wereszczak, A A a Lin, H T a Kirkland, T P a Andrews, M J b Lee, S K b

a OAK RIDGE NATIONAL LABORATORY (United States)

b CATERPILLAR INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CRACK PROPAGATION; FATIGUE OF MATERIALS; HOT PRESSING; PHASE EQUILIBRIA; SINTERING; STRESS ANALYSIS; THERMAL EFFECTS; THERMAL EXPANSION; VOLUME FRACTION;

COEFFICIENT OF THERMAL EXPANSION (CTE); DYNAMIC FATIGUE;

SILICON NITRIDE;

EID: 0036641541 PISSN: 00222461 EISSN: None Source Type: Journal
DOI: 10.1023/A:1015860831290 Document Type: Article

Times cited : (10)

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