SCOPUS 정보 검색 플랫폼

Volumn 18, Issue 3, 2002, Pages 274-287

Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly - part I: Creep constitutive relation and fatigue model

(5) Xunqing, Shi a Zhiping, Wang b Pang, John H L b Xueren, Zhang a Jingxu, Nie a

a BEIHANG UNIVERSITY (China)

b NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

Author keywords

Constitutive relation; Creep fatigue interaction; Dislocation controlled creep flow; Life prediction model; Solder joint reliability

Indexed keywords

COMPUTER SIMULATION; CREEP; RELIABILITY; SOLDERING ALLOYS; TIN ALLOYS;

CONSTITUTIVE RELATION; CREEP FATIGUE INTERACTION; DISLOCATION CONTROLLED CREEP FLOW; PLASTIC BALL GRID ARRAY ASSEMBLY;

SOLDERED JOINTS;

EID: 0036620553 PISSN: 05677718 EISSN: None Source Type: Journal
DOI: 10.1007/BF02487955 Document Type: Article

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.