Thermal flow and chemical shrink techniques for sub-100 nm contact hole fabrication in electron beam lithography

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 6 B, 2002, Pages 4163-4166

  Chen, Hsuen Li ^a,b   Ko, Fu Hsiang ^a   Li, Lung Sheng ^a   Hsu, Chien Kui ^a   Chen, Ben Chang ^a   Chu, Tieh Chi ^a  

^a NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Chemical shrink method; Chemically amplified resist; Contact hole fabrication; Electron beam lithography; Thermal flow method

Indexed keywords

ELECTRON BEAMS; FABRICATION; PHOTORESISTS; SHRINKAGE; THERMAL EFFECTS; ULTRAVIOLET RADIATION;

CONTACT HOLE FABRICATION;

ELECTRON BEAM LITHOGRAPHY;

EID: 0036614427     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.4163     Document Type: Article

References (7)