Development of the binder system for solvent and thermal debinding in MIM process

Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy

Volumn 49, Issue 6, 2002, Pages 518-521

  Itoh, Yoshinori ^a   Harikou, Tatsuya ^a   Satoh, Kenji ^a   Miura, Hideshi ^a  

^a HIRISP   (Japan)

Author keywords

Binder; Metal injection molding; Solvent debinding; Thermal debinding; Thermal properties

Indexed keywords

BINDERS; COMPOSITION; PYROLYSIS; RESINS; SOLUBILITY; SOLVENTS; THERMOGRAVIMETRIC ANALYSIS;

THERMAL DEBINDING;

INJECTION MOLDING;

EID: 0036614051     PISSN: 05328799     EISSN: None     Source Type: Journal    
DOI: 10.2497/jjspm.49.518     Document Type: Article

References (0)