Fluidic self-assembly of semiconductor devices: A promising new method of mass-producing flexible circuitry

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 6 B, 2002, Pages 4366-4369

  Snyder, Eric J ^a   Chideme, John ^a   Craig, Gordon S W ^a  

^a Alien Technology Corporation   (United States)

Author keywords

Boundary layer lubrication; Flexible electronics; Fluidic self assembly; Keyed shapes

Indexed keywords

BOUNDARY LAYERS; FILLING; LUBRICATION; MICROPROCESSOR CHIPS; SELF ASSEMBLY; VISCOSITY;

FLUIDIC SELF-ASSEMBLIES (FSA);

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036614002     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.41.4366     Document Type: Article

References (8)