The tensile property of commercial Bi2223 tapes: A report on the international round-robin test

Superconductor Science and Technology

Volumn 15, Issue 6, 2002, Pages 888-893

  Osamura, K ^a   Sugano, M ^a   Nyilas, A ^b   Shin, H S ^c   Weijers, H ^d   Hampshire, D P ^e   Morley, N ^e   Morley, K ^e   Keys, S ^e   Leghissa, M ^f   Herkert, W ^f   Katagiri, K ^g   Ogata, T ^h  

^a KYOTO UNIVERSITY   (Japan)

^b KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^c Andong National University   (South Korea)

^d FLORIDA STATE UNIVERSITY   (United States)

^e DURHAM UNIVERSITY   (United Kingdom)

^f SIEMENS AG   (Germany)

^g IWATE UNIVERSITY   (Japan)

^h NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; ELASTIC MODULI; FRACTURE; MICROSTRUCTURE; OXIDE SUPERCONDUCTORS; TENSILE STRENGTH; TENSILE TESTING; YIELD STRESS;

INTERNATIONAL ROUND ROBIN TEST; INTRINSIC PROPERTIES; THERMAL CONTRACTION COEFFICIENT;

BISMUTH COMPOUNDS;

EID: 0036602877     PISSN: 09532048     EISSN: None     Source Type: Journal    
DOI: 10.1088/0953-2048/15/6/308     Document Type: Article

References (9)

1. Metallic materials - Tensile testing at ambient temperature
2. Mechanical properties measurement - Room temperature tensile test of Cu/Nb-Ti composite superconductors (part 6)