Control of heat transfer and growth uniformity of solidifying copper shells through substrate temperature

Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science

Volumn 33, Issue 3, 2002, Pages 403-411

  Bouchard, Dominique ^a   Howes, Belinda ^a   Paumelle, Clotilde ^a   Nadeau, Jean Paul ^a   Simard, Daniel ^b   Hamel, François G ^b  

^a NATIONAL RESEARCH COUNCIL CANADA   (Canada)

^b UNIVERSITY OF BRITISH COLUMBIA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; GROWTH (MATERIALS); INTERFACES (MATERIALS); SOLIDIFICATION; SUBSTRATES; THERMOANALYSIS;

DENDRITE STRUCTURES; MICROGRAPHY;

HEAT TRANSFER;

EID: 0036600805     PISSN: 10735615     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11663-002-0052-z     Document Type: Article

References (49)