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Volumn 93, Issue 5, 2002, Pages 438-443
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Bonding between Cu and α-Al2O3
a a a a a |
Author keywords
Cu Al2O3 interfaces; Electron energy loss spectroscopy; Transmission electron microscopy; Al2O3 surface preparation
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Indexed keywords
ALUMINA;
ANNEALING;
CHEMICAL BONDS;
CHEMICAL CLEANING;
COPPER;
ELECTRON ENERGY LOSS SPECTROSCOPY;
HIGH PRESSURE EFFECTS;
HIGH TEMPERATURE EFFECTS;
INTERFACES (MATERIALS);
INTERMETALLICS;
MOLECULAR BEAM EPITAXY;
SPUTTERING;
SURFACE CHEMISTRY;
TRANSMISSION ELECTRON MICROSCOPY;
DIFFUSION BONDING;
CERMETS;
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EID: 0036573034
PISSN: 00443093
EISSN: None
Source Type: Journal
DOI: 10.3139/146.020438 Document Type: Article |
Times cited : (13)
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References (20)
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