A review of epoxy materials and reinforcements, part 2

Printed Circuit Fabrication

Volumn 25, Issue 5, 2002, Pages 32-36

  Ehrler, Sylvia ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); EPOXY RESINS; LAMINATES; MECHANICAL PROPERTIES; PERMITTIVITY; REINFORCEMENT; SOLDERING; THERMAL STRESS; THERMODYNAMIC STABILITY;

THERMOUNT;

PRINTED CIRCUIT MANUFACTURE;

EID: 0036572076     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (8)

1. Comparison of halogen free base materials
2. Introduction of thermount rein forced materials into printed circuit board manufacturing
3. Investigation of speedboard material for printed circuit board manufacturing
4. New applications for nonwoven aramid reinforcement which demand advanced physical properties
5. Flip-chip on laminate reliability - Failure mechanisms
6. Empfehlungen zur herstellung von löchern mittels laserablation in leiterplatten und multilayern, die mit thermount nichtgewebtem aramid verstärkt sind
7. Microvias in glasverstärkten materialien
8. Herstellung und designrules von HDI-schaltungen