Interconnection technology for new type thin film modules

Journal of the Ceramic Society of Japan

Volumn 110, Issue 1281, 2002, Pages 485-487

  Masuda, Hidetoshi ^a   Fujimoto, Masayuki ^a  

^a TAIYO YUDEN CO LTD   (Japan)

Author keywords

Aluminum interconnect; Interlayer connection; Thin film module

Indexed keywords

ATOMIC FORCE MICROSCOPY; CAPACITORS; ELECTRODES; HETEROJUNCTION BIPOLAR TRANSISTORS; OXIDATION; REACTIVE ION ETCHING; SEMICONDUCTING GALLIUM ARSENIDE; STRONTIUM COMPOUNDS;

INTERLAYER CONNECTIONS;

THIN FILMS;

EID: 0036565191     PISSN: 09145400     EISSN: None     Source Type: Journal    
DOI: 10.2109/jcersj.110.485     Document Type: Article

References (12)

1. Maikuro-mashiningu to maikuro-mekatoronikusu
2. Kyo-yudentai hakumaku memori