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Volumn 52, Issue 4, 2002, Pages 179-184
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Resistometric investigation on effect of Cu addition on 473 K aging behavior of Al-1% Mg2 Si alloys
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Author keywords
Al Mg Si alloy; As quenched state; Cu addition; Precipitation hardening; Resistivity
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Indexed keywords
ADDITION REACTIONS;
AGE HARDENING;
AGING OF MATERIALS;
COMPOSITION EFFECTS;
COPPER;
NUMERICAL ANALYSIS;
QUENCHING;
SOLUBILITY;
TENSILE TESTING;
THERMAL EFFECTS;
TRANSMISSION ELECTRON MICROSCOPY;
ALUMINUM MAGNESIUM SILICON ALLOYS;
RESISTOMETRY;
SOFTENING;
ALUMINUM ALLOYS;
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EID: 0036542623
PISSN: 04515994
EISSN: None
Source Type: Journal
DOI: 10.2464/jilm.52.179 Document Type: Article |
Times cited : (2)
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References (22)
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