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Volumn 11, Issue 4, 2002, Pages 21-23
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Wafer-level MEMS packaging
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Author keywords
[No Author keywords available]
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Indexed keywords
BOLOMETERS;
CERAMIC MATERIALS;
ELECTRIC CONTACTS;
ENCAPSULATION;
ETCHING;
HERMETIC SEALS;
INFRARED RADIATION;
MICROELECTROMECHANICAL DEVICES;
MICROMACHINING;
OPTIMIZATION;
PLASTIC PARTS;
SEMICONDUCTOR RELAYS;
SUBSTRATES;
WSI CIRCUITS;
ELECTROMAGNETICALLY ACTUATED MICRORELAYS;
INDENT-REFLOW-SEALING (IRS) METHODS;
WAFER-LEVEL PACKAGINGS;
CHIP SCALE PACKAGES;
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EID: 0036539255
PISSN: 10650555
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (5)
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References (0)
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