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Volumn 51, Issue 4, 2002, Pages 445-450
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Prediction of mechanical properties of lead-free solders using indentation method
a
a
HITACHI LTD
(Japan)
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Author keywords
Creep; Elastic; FEM analysis; Indentation method; Lead free solder; Mechanical properties; Plastic
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Indexed keywords
ACTIVATION ENERGY;
CREEP;
ELASTIC MODULI;
ELASTICITY;
FINITE ELEMENT METHOD;
INDENTATION;
PLASTICITY;
SILVER ALLOYS;
TENSILE STRENGTH;
VICKERS HARDNESS TESTING;
YIELD STRESS;
CREEP DEFORMATION;
LEAD FREE SOLDERS;
LOAD DISPLACEMENT CURVE;
NORTON LAW;
SOLDERING ALLOYS;
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EID: 0036528782
PISSN: 05145163
EISSN: None
Source Type: Journal
DOI: 10.2472/jsms.51.445 Document Type: Article |
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Times cited : (10)
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References (12)
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