Evaluation of surface and subsurface cracks in nanoscale-machined single-crystal silicon by scanning force microscope and scanning laser microscope

Materials Characterization

Volumn 48, Issue 2-3, 2002, Pages 141-145

  Sumomogi, Tsunetaka ^a   Nakamura, Masayoshi ^a   Endo, Toshiro ^a   Goto, Takayuki ^b   Kaji, Satoshi ^b  

^a HIROSHIMA KOKUSAI GAKUIN UNIVERSITY   (Japan)

^b MITSUBISHI HEAVY INDUSTRIES LTD   (Japan)

Author keywords

Nanoscale machining; Scanning force microscope; Scanning laser microscope; Single crystal silicon; Subsurface crack; Surface crack

Indexed keywords

CRACKS; MACHINING; MICROSCOPES; SILICON;

SUBSURFACE CRACKS;

SINGLE CRYSTALS;

EID: 0036526386     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1044-5803(02)00198-5     Document Type: Conference Paper

References (8)

1. Ductile-regime grinding: A new technology for machining brittle materials
2. Single point diamond machining of glasses
3. Energy scaling transitions in machining of silicon by diamond
4. Controlled microcutting tests on single crystal silicon
5. Behavior of various cracks caused in the machining of glass with a diamond cone
6. The study of ductile-brittle transition on microcutting of single crystal silicon
7. Elastic/plastic indentation damage in ceramics: The lateral crack system
8. Elastic/plastic indentation damage in ceramics: Median/radian crack system