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Volumn 14, Issue 3, 2002, Pages 38-45
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Packaging options for wireless IC designs
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATERIALS;
COMPUTER SIMULATION;
COMPUTER SOFTWARE;
HEAT CONDUCTION;
HEAT TRANSFER;
INTEGRATED CIRCUIT MANUFACTURE;
PERSONAL COMMUNICATION SYSTEMS;
PLASTICS;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT MANUFACTURE;
PRINTED CIRCUIT TESTING;
THERMAL CONDUCTIVITY OF SOLIDS;
THERMAL EXPANSION;
DUAL IN-LINE PACKAGES (DIP);
ELECTRONICS PACKAGING;
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EID: 0036506438
PISSN: 10750207
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (2)
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References (0)
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