Image processing techniques for wafer defect cluster identification

IEEE Design and Test of Computers

Volumn 19, Issue 2, 2002, Pages 44-48

  Huang, Chenn Jung ^c   Wang, Chua Chin ^a   Wu, Chi Feng ^b  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NXP SEMICONDUCTORS   (Netherlands)

^c Department of Computer Science and Information Education   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECT DENSITY DISTRIBUTION; NEAREST NEIGHBOR CLUSTERING; WAFER DEFECT CLUSTER IDENTIFICATION;

ALGORITHMS; AUTOMATIC TESTING; COMPUTER AIDED SOFTWARE ENGINEERING; IMAGE PROCESSING; INTEGRATED CIRCUIT TESTING; WSI CIRCUITS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036494840     PISSN: 07407475     EISSN: None     Source Type: Journal    
DOI: 10.1109/54.990441     Document Type: Article

References (10)

1. Patterned wafer inspection using spatial filtering for cluster environment
2. A neural-network approach to recognize defect spatial pattern in semiconductor fabrication
3. Improving wafer yields at low k1 with advanced photomask defect detection
4. In-line yield prediction methodologies using patterned wafer inspection information
5. Extraction of wafer-level defect density distribution to improve yield prediction
6. A review on image segmentation techniques