Coupled thermal-electromagnetic simulation of a microwave curing cell

IEEE Transactions on Magnetics

Volumn 38, Issue 2, 2002, Pages 977-980

  Pichon, Lionel ^a   Meyer, Olivier ^a  

^a SUPELEC   (France)

Author keywords

Coupled problem; Finite element method; Microwave heating

Indexed keywords

FINITE ELEMENT METHOD; MAGNETIC FIELDS; MICROWAVE HEATING; POLYMERS; RESINS; THERMOANALYSIS;

COUPLED PROBLEMS; THERMAL-ELECTROMAGNETIC SIMULATION;

ELECTROMAGNETISM;

EID: 0036493538     PISSN: 00189464     EISSN: None     Source Type: Journal    
DOI: 10.1109/20.996251     Document Type: Article

References (5)

1. Instrumentation for wide frequency range measurements of epoxy resin during microwave curing
2. 3D FEM magneto-thermal analysis in microwave ovens
3. An electromagnetic and thermal analysis in biological bodies using 3-D FE and absorbing boundary conditions
4. Hybrid finite element and boundary element method using time-stepping for eddy current calculation in axisymmetric problems