Micromechanics analysis for elastic modulus, coefficient of thermal expansion and thermal conductivity of anisotropic closed-cell metal foams

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 66, Issue 2, 2002, Pages 53-59

  Kitazono, Koichi ^a   Sato, Eiichi ^a   Kuribayashi, Kazuhiko ^a  

^a JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

Author keywords

Closed cell metal foam; Coefficient of thermal expansion; Elastic modulus; Lotus structured porous copper; Micromechanics; Thermal conductivity

Indexed keywords

ANISOTROPY; CONTINUUM MECHANICS; COPPER; ELASTIC MODULI; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

METAL FOAMS;

FOAMS;

EID: 0036475609     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet1952.66.2_53     Document Type: Article

References (22)