Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor

Microelectronics Reliability

Volumn 42, Issue 2, 2002, Pages 285-291

  Lo, Yu Lung ^a   Tsao, Chih Chiang ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD; STRAIN RATE; SUPERCONDUCTING WIRE;

WIREBOND PROFILES;

ELECTRONICS PACKAGING;

EID: 0036473351     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00246-3     Document Type: Article

References (12)

1. Crossing the 200 wire barrier in VLSI bonding
2. Fine pitch wire bonding development using a new multipurpose, multi-pad pitch test die
3. Wire bond loop profile development for fine pitch-long wire assembly
4. Finite element simulation of wire looping during wirebond fabrication
5. Linkage-spring model in analyzing wirebonding loops
6. Designs of wirebonding profile using simple linkage-spring model
7. Gold wire weakening in the first thermosonic bonding of the first bond
8. Development of linear motor for wire bonder
9. The structure and mechanical properties of fine diameter Al-1pct Si wire