High-performance inter-PCB connectors: Analysis of EMI characteristics

IEEE Transactions on Electromagnetic Compatibility

Volumn 44, Issue 1, 2002, Pages 165-174

  Ye, Xiaoning ^a,b,c   Drewniak, James L ^a,b   Nadolny, Jim ^d   Hockanson, David M ^a,e  

^a IEEE   (United States)

^b University of Missouri Rolla   (United States)

^c INTEL CORPORATION   (United States)

^d FCI Electronics   (United States)

^e SUN MICROSYSTEMS   (United States)

Author keywords

Common mode current; Finite differnece time domain (FDTD); Inter printed circuit board (inter PCB) connector; Near field; S parameter

Indexed keywords

COMMON-MODE CURRENTS;

ELECTRIC CONNECTORS; FINITE DIFFERENCE METHOD; FREQUENCIES; PRINTED CIRCUIT BOARDS; TIME DOMAIN ANALYSIS;

SIGNAL INTERFERENCE;

EID: 0036464672     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/15.990723     Document Type: Article

References (14)

1. Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables
2. FDTD and experimental investigation of EMI from stacked-card PCB configurations
3. EMI associated with inter-board connection for module-on-backplane and stacked-card configurations
4. FDTD analysis of electromagnetic radiation from modules-on-back-plane configuration
5. Backplane connector radiated emission and shielding effectiveness
6. An improved triaxial cell for transfer impedance measurements on multi-pins backplane connectors
7. Measured electromagnetic shielding performance of commonly used cables and connectors
8. Transfer impedance testing of multiconductor shielded connectors of arbitrary cross section
9. Measured surface transfer impedance of multipin micro-D subminiature and LFH connector assemblies at frequencies up to 1 GHz
10. Shielding of backplane interconnection technology systems (EU SOBITS project)
11. The thin wire
12. Perfectly matched layer for the absorption of electromagnetic waves