Micro inspection for wafer bumping

Advanced Packaging

Volumn 11, Issue 2, 2002, Pages 19-22

  Hibert, Steve ^a  

^a KLA TENCOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; ELECTROLESS PLATING; ELECTROPLATING; EVAPORATION; FLIP CHIP DEVICES; IMAGING SYSTEMS; LEAD METALLURGY; MONITORING; PASSIVATION; PHOTORESISTS; PROFILOMETRY; SOLDERING; SPUTTER DEPOSITION; SURFACE TENSION; TIN METALLURGY;

WAFER BUMPING; WAFER-LEVEL PACKAGINGS (WLP);

CHIP SCALE PACKAGES;

EID: 0036464402     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. Flip chip markets and infrastructure development
2. Considerations for an electroplated flip chip process