Acoustic compression for the thermal management of multi-load electronic systems

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 395-402

  Bash, Cullen E ^a   Patel, Chandrakant D ^a   Beitelmal, Abdlmonem ^a   Burr, Ronald F ^b  

^a HEWLETT PACKARD LABORATORIES   (United States)

^b MacroSonix Corporation   (United States)

Author keywords

Acoustic compressors; Electronics cooling; Refrigeration analysis; Thermal management

Indexed keywords

COMPRESSORS; COOLING; MICROPROCESSOR CHIPS; REFRIGERATION; SERVERS;

MICROPROCESSOR POWER DENSITIES;

HEAT LOSSES;

EID: 0036459759     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Patel, C.D., 2000, "Enabling Pumped Liquid Loop Cooling: Justification and the Key Technology and Cost Barriers", International Conference and Exhibition on High Density and Systems Packaging, Denver, pp 145-152.
2. Patel C.D., 1994, "Backside Cooling Solution for High Power Flip Chip Multi-chip Modules," 44th IEEE Proceedings, May1994, pp 442-449.
3. Bash, C.B., 2001, "Analysis of Refrigerated Loops for Electronics Cooling", IPACK, July 2001, Kauai, HI.
4. Schmidt, R., 2000, "Low Temperature Electronic Cooling", Electronics Cooling, 6, No. 3, pp. 18-24.
5. C. Lawrenson, C., B. Lipkens, T.S. Lucas, D.K. Perkins, and T.W. Van Doren, 1998, "Measurements of macrosonic standing waves in oscillating closed cavities," J. Acoust. Soc. Am. 104, 623-636.
6. Ilinskii, Y.A., B. Lipkens, T.S. Lucas, T.W. Van Doren, and E.A. Zabolotskaya, 1998, "Nonlinear standing waves in an acoustical resonator," J. Acoust. Soc. Am. 104, 2664-2674.
7. Bash, C.B., 2000, "A Hybrid Approach to Plate Fin-Tube Heat Exchanger Analysis", Proceedings of the International Conference and Exhibition on High Density Interconnect and Systems Packaging, Denver, CO, April 25-28, pp. 40-48.
8. Carey, V.P., Liquid-Vapor Phase-Change Phenomena, Taylor and Francis, 1992.