Effect of thermal cycling to the strength and fracture of SiC-based candle filters

Ceramic Engineering and Science Proceedings

Volumn 23, Issue 3, 2002, Pages 607-613

  Pastila, Pirjo ^a   Nikkilä, Antti Pekka ^a   Mäntylä, Tapio ^a   Lara Curzio, Edgar ^b  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FRACTURE TOUGHNESS; MICROSTRUCTURE; SILICON CARBIDE; STRAIN; STRENGTH OF MATERIALS; TEMPERATURE; TENSILE STRENGTH; TENSILE STRESS; THERMAL CYCLING;

CLAY-BONDED CERAMIC CANDLE FILTERS; TENSILE AXIAL STRENGTH;

CERAMIC MATERIALS;

EID: 0036458814     PISSN: 01966219     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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