Effect of the thermostatic expansion valve characteristics on the stability of a refrigeration system - Part I

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 403-407

  Kulkarni, Amit ^a   Mulay, Veerendra ^a   Agonafer, Dereje ^a   Schmidt, Roger ^b  

^a University of Texas at Arlington   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYOGENICS; EVAPORATION; MICROPROCESSOR CHIPS; OSCILLATIONS; REFRIGERATION; THERMAL LOAD; THERMOSTATS;

POWER DISSIPATION;

HEAT FLUX;

EID: 0036457821     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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3. Needham, Prunty, and Yeoh, "High Volume Microprocessor Test Escapes, An analysis of Defects our Tests are missing," International Test Conference, pg. 25-34(1998).
4. Peeples, John W., "Vapor Compression Cooling for High Performance Applications", Electronics Cooling Magazine, August 2001.
5. Ding, Agonafer and Schmidt, "Mathematical Model for Thermostatic Expansion Valve", EEP Vol 28, IMECE 2000, Orlando.
6. rd Annual Meeting, Toronto, Canada, no. 2006,June 1966.
7. Danning P., Liquid-feed regulation by thermostatic expansion valve. Journal of Refrigeration 1992; 52 5.
8. Ibrahim, Ghaleb A., "Theoretal Investigation Into Instability of a Refrigeration System with an Evaporator Controlled by a Thermostatic Expansion Valve", The Canadian Journal Of Chemical Engineering, Vol. 76, August 1998.
9. Heating Piping Air Conditioning, Vol 62 No.7, July 1990.
10. 1997 ASHRAE Fundamentals Handbook.
11. Broersen P.M.T. and Van der Jagt M.F.G., Hunting of evaporator controlled by a thermostatic expansion valve, transactions of ASME, Journal of Dynamic System Measurement and Control, 1980; 102:130 5.