Size considerations in interfacing thermoacoustic coolers with electronics

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 421-424

  Abdel Rahman, E ^a   Azenui, N C ^a   Korovyanko, I ^a   Symko, Orest G ^a  

^a UNIVERSITY OF UTAH   (United States)

Author keywords

Cooler; Microcircuits; Thermoacoustics

Indexed keywords

ACOUSTIC DEVICES; COOLING; HEAT PUMP SYSTEMS; MICROELECTRONICS; SPECIFIC HEAT;

THERMOACOUSTIC COOLERS;

COOLING SYSTEMS;

EID: 0036457779     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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