The effect of interface pressure on thermal joint conductance for flexible graphite materials: Analytical and experimental study

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 663-670

  Marotta, E E ^a   LaFontant, S ^a   McClafferty, D ^a   Mazzuca, S ^a   Norley, J ^b  

^a IBM   (United States)

^b GrafTech International Ltd   (United States)

Author keywords

Elastic interstitial layers; Graphite; Non metallic foils; Thermal contact resistance; Thermal interface materials (TIM)

Indexed keywords

ELASTIC MODULI; GRAPHITE; HEAT RESISTANCE; HEAT TRANSFER; MICROELECTRONICS; PHASE TRANSITIONS; POISSON RATIO; THERMAL CONDUCTIVITY; THERMAL DIFFUSION;

THERMAL INTERFACE MATERIALS (TIM);

INTERFACES (MATERIALS);

EID: 0036457268     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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