C-coupon studies of SiC/SiC composites part II: Microstructural characterization

Ceramic Engineering and Science Proceedings

Volumn 23, Issue 3, 2002, Pages 387-393

  Hurwitz, Frances I ^a   Calomino, Anthony M ^a   McCue, Terry R ^b   Morscher, Gregory N ^a  

^a NASA GLENN RESEARCH CENTER   (United States)

^b QSS GROUP INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EMISSIONS; CRACK INITIATION; CRYSTAL MICROSTRUCTURE; FRACTURE; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; TENSILE STRENGTH; TENSILE TESTING;

BUTTON TEST; C-COUPON; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; HOOP STRESSES; INTERLAMINAR TENSILE STRENGTH;

FIBER REINFORCED MATERIALS;

EID: 0036455148     PISSN: 01966219     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. Cui, G.Y. and C. Ruiz. Through-Thickness Failure of Laminated C/Epoxy Composites under Combined Stress. in SEM Spring Conf. Exp. Mechanics. 1994: Society for Experimental Mechanics, Bethel, CT.
3. Ko, W.L. and R.H. Jackson. Multilayer Theory for Delamination Analysis of a Composite Curved Bar Subjected to End Forces and End Moments. in 5th International Conference on Composite Structures. 1989. Paisley, Scotland.
4. Lu, T.J., Z.C. Xia, and J.W. Hutchinson, Delamination of Beams under Transverse Shear and Bending. Mater. Sci. Eng., A, 1194. 188 (1-2): p. 103-12.
5. Abdul-Aziz, A., et al., C-Coupon Studies of CMCs: Fracture Behavior and Microstructural Characterization. Ceram. Eng. and Sci. Proc., 2001, 22(3): p. 569-576.
6. Hurwitz, F.I., et al., C-Coupon Studies of CMC's: Fracture Behavior and Microstructural Characterization. Ceram. Eng. Soc. Proc., 2001. 22(3): p. 577-584.
7. Morscher, G.N., F.I. Hurwitz, and A.M. Calomino, C-Coupon Studies of SiC/SiC Cpmposites Part I: Acoustic Emission Monitoring. Ceram. Eng. Sci. Proc., this volume, 2002.