Implementation of integrated packaging of DC/DC converter and PFC IPEMs using bumpless interconnected embedded chip technology

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 637-640

  Liang, Zhenxian ^a   Van Wyk, J D ^a   Lee, Fred C ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

3 D embedded chip MCM; Deposited metallization interconnect; Integrated packaging of power electronics modules; Parasitic parameters; Screen printed dielectric isolation

Indexed keywords

ALUMINA; ALUMINUM NITRIDE; ELECTRIC CONVERTERS; METALLIZING; MULTICHIP MODULES; PRINTED CIRCUITS; SCREEN PRINTING; SEMICONDUCTING ALUMINUM COMPOUNDS;

CHIP ON BOARD; INTEGRATED PACKAGING; INTEGRATED POWER ELECTRONICS MODULE; PARASITIC PARAMETERS;

POWER ELECTRONICS;

EID: 0036453576     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Z.X. Liang, F. C. Lee, G.-Q. Lu, and D. Borojevic, "Embedded Power - a multilayer integration technology for packaging of IPEMs and PEBBs," Proceedings of International Workshop on Integrated Power Packaging, Waltham, MA, July 14-16, P.41, 2000