Crack propagation behaviour of four types of lead and lead-free solders in push-pull low cycle fatigue

Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 68, Issue 1, 2002, Pages 88-95

  Nose, Haruo ^a   Sakane, Masao ^b   Yamashita, Mitsuo ^b   Shiokawa, Kunio ^b  

^a OSAKA SANGYO UNIVERSITY   (Japan)

^b NONE

Author keywords

Crack propagation; Electronic device; J integral; Low cycle fatigue; Solders; Tensile property

Indexed keywords

CRACK PROPAGATION; DUCTILITY; ELECTRONIC EQUIPMENT; FATIGUE OF MATERIALS; LEAD; TEMPERATURE; TENSILE PROPERTIES;

J-INTEGRAL RANGE; LEAD-FREE SOLDERS; PUSH-PULL STRAINING;

SOLDERING ALLOYS;

EID: 0036448042     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.68.88     Document Type: Article

References (13)

1. 65-632, A(1999), 901.
2. 44-8, (1995), 1080.
3. 46-8, (1997), 969.
4. 46-12 (1997), 1381.
5. (1998).
6. (1999), 116.
7. (1997), 100.
8. (1998), 35.
9. (2000).
10. Dowling, N.E. and Begley, J.A.: ASTM STP 590,(1976), 82.
11. Dowling, N.E.: ASTM STP 601, (1976), 19.
12. (2000).
13. (1984), 3201,